Find code ID infos| Code | |||
| Examples: | |||
| Wafer | |||
| Die | |||
| PCB | |||
| PCB onto PCB | |||
| List of Steps | ||||||
| Date | ID | Type | Company Unit | Company Type | Step | Type |
|---|---|---|---|---|---|---|
| 2022-06-01 10:10:01 | DIGITHO/00000002 | wafer | Fab_1 | Fab_speciality | Lithography Identification | Identification |
| 2022-06-01 10:10:02 | DIGITHO/00000002 | wafer | OSAT_1 | OSAT | saw dicing | Cutting |
| 2022-06-01 10:10:03 | ***DIGITHO/00000007*** | die | OSAT_1 | OSAT | Pick&Place | Pick-place |
| 2022-06-01 10:10:04 | DIGITHO/00000005 | PCB | OSAT_1 | OSAT | In-line inspection | Inspection |
| 2022-06-01 10:10:04 | DIGITHO/00000005 | PCB | OSAT_1 | OSAT | Defect highlighted | Inspection |
| 2022-06-01 10:10:05 | DIGITHO/00000005 | PCB | OSAT_1 | OSAT | Final Inspection | Inspection |
| Sub Chip | Type | Width (mm) | heigth (mm) | Coord X (mm) | Coord Y (mm) | Ensemble Chip | Company Unit | Country | Type | Size X (mm) | Size Y (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| DIGITHO/00000007 | die | 2 | 2 | 0 | 98 | DIGITHO/00000002 | Fab_1 | Canada | wafer | 200 | 200 |
| Sub Chip | Type | Width (mm) | heigth (mm) | Coord X (mm) | Coord Y (mm) | Ensemble Chip | Company Unit | Country | Type | Size X (mm) | Size Y (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| DIGITHO/00000007 | die | 2 | 2 | 10 | 25 | DIGITHO/00000005 | Fab_2 | Taiwan | PCB | 50 | 100 |
| Chip | Company Unit | Country | Type | Size X (mm) | Size Y (mm) | DIGITHO/00000007 | Fabless_1 | France | die | 2 | 2 |
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