Code | |||
Examples: | |||
Wafer | |||
Die | |||
PCB | |||
PCB onto PCB |
List of Steps | ||||||
Date | ID | Type | Company Unit | Company Type | Step | Type |
---|---|---|---|---|---|---|
2022-06-01 10:10:01 | DIGITHO/00000003 | wafer | Fab_2 | Fab_digital | Lithography Identification | Identification |
2022-06-01 10:10:02 | DIGITHO/00000003 | wafer | Fab_2 | Fab_digital | saw dicing | Cutting |
2022-06-01 10:10:03 | ***DIGITHO/00000008*** | die | OSAT_1 | OSAT | Pick&Place | Pick-place |
2022-06-01 10:10:04 | DIGITHO/00000005 | PCB | OSAT_1 | OSAT | In-line inspection | Inspection |
2022-06-01 10:10:04 | DIGITHO/00000005 | PCB | OSAT_1 | OSAT | Defect highlighted | Inspection |
2022-06-01 10:10:05 | DIGITHO/00000005 | PCB | OSAT_1 | OSAT | Final Inspection | Inspection |
Sub Chip | Type | Width (mm) | heigth (mm) | Coord X (mm) | Coord Y (mm) | Ensemble Chip | Company Unit | Country | Type | Size X (mm) | Size Y (mm) |
---|---|---|---|---|---|---|---|---|---|---|---|
DIGITHO/00000008 | die | 2 | 2 | 0 | 48 | DIGITHO/00000003 | Fab_2 | Taiwan | wafer | 100 | 100 |
Sub Chip | Type | Width (mm) | heigth (mm) | Coord X (mm) | Coord Y (mm) | Ensemble Chip | Company Unit | Country | Type | Size X (mm) | Size Y (mm) |
---|---|---|---|---|---|---|---|---|---|---|---|
DIGITHO/00000008 | die | 2 | 2 | -10 | 42 | DIGITHO/00000005 | Fab_2 | Taiwan | PCB | 50 | 100 |
Chip | Company Unit | Country | Type | Size X (mm) | Size Y (mm) | DIGITHO/00000008 | Fabless_1 | France | die | 2 | 2 |
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