Find code ID infos| Code | |||
| Examples: | |||
| Wafer | |||
| Die | |||
| PCB | |||
| PCB onto PCB | |||
| List of Steps | ||||||
| Date | ID | Type | Company Unit | Company Type | Step | Type |
|---|---|---|---|---|---|---|
| 2022-06-01 10:10:01 | DIGITHO/00000004 | wafer | OSAT_1 | OSAT | Lithography Identification | Identification |
| 2022-06-01 10:10:01 | DIGITHO/00000006 | PCB | Fab_3 | Fab_digital | PCB cutting | Cutting |
| 2022-06-01 10:10:02 | DIGITHO/00000004 | wafer | OSAT_1 | OSAT | Shipping | Other |
| 2022-06-13 10:10:01 | DIGITHO/00000006 | PCB | Fab_3 | Fab_digital | PCB Plating | Other |
| 2022-06-14 10:10:01 | DIGITHO/00000006 | PCB | Fab_3 | Fab_digital | PCB Mounting | Merge |
| Sub Chip | Type | Width (mm) | heigth (mm) | Coord X (mm) | Coord Y (mm) | Ensemble Chip | Company Unit | Country | Type | Size X (mm) | Size Y (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| DIGITHO/00000009 | die | 2 | 2 | 0 | 148 | DIGITHO/00000004 | Fab_3 | USA | wafer | 300 | 300 |
| Sub Chip | Type | Width (mm) | heigth (mm) | Coord X (mm) | Coord Y (mm) | Ensemble Chip | Company Unit | Country | Type | Size X (mm) | Size Y (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| DIGITHO/00000009 | die | 2 | 2 | 2.5 | 0 | DIGITHO/00000006 | OSAT_2 | Philippine | PCB | 10 | 10 |
| Chip | Company Unit | Country | Type | Size X (mm) | Size Y (mm) | DIGITHO/00000009 | Fabless_1 | France | die | 2 | 2 |
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